JPH065614Y2 - チップ部品自動外観検査機における部品搬送機構 - Google Patents

チップ部品自動外観検査機における部品搬送機構

Info

Publication number
JPH065614Y2
JPH065614Y2 JP1987161772U JP16177287U JPH065614Y2 JP H065614 Y2 JPH065614 Y2 JP H065614Y2 JP 1987161772 U JP1987161772 U JP 1987161772U JP 16177287 U JP16177287 U JP 16177287U JP H065614 Y2 JPH065614 Y2 JP H065614Y2
Authority
JP
Japan
Prior art keywords
component
chip
air jet
inspection machine
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987161772U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0166061U (en]
Inventor
亨 水野
保彦 北島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1987161772U priority Critical patent/JPH065614Y2/ja
Priority to KR1019890002517A priority patent/KR0122739B1/ko
Publication of JPH0166061U publication Critical patent/JPH0166061U/ja
Application granted granted Critical
Publication of JPH065614Y2 publication Critical patent/JPH065614Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP1987161772U 1987-08-28 1987-10-22 チップ部品自動外観検査機における部品搬送機構 Expired - Lifetime JPH065614Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987161772U JPH065614Y2 (ja) 1987-10-22 1987-10-22 チップ部品自動外観検査機における部品搬送機構
KR1019890002517A KR0122739B1 (ko) 1987-08-28 1989-02-28 칩-형 부품(chip-type components)을 분류하고 칩-형 부품의 외관을 광학적으로 점검하기 위한 방법과 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161772U JPH065614Y2 (ja) 1987-10-22 1987-10-22 チップ部品自動外観検査機における部品搬送機構

Publications (2)

Publication Number Publication Date
JPH0166061U JPH0166061U (en]) 1989-04-27
JPH065614Y2 true JPH065614Y2 (ja) 1994-02-09

Family

ID=31445003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161772U Expired - Lifetime JPH065614Y2 (ja) 1987-08-28 1987-10-22 チップ部品自動外観検査機における部品搬送機構

Country Status (1)

Country Link
JP (1) JPH065614Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002341407A (ja) * 2001-05-15 2002-11-27 Shibuya Kogyo Co Ltd 被検査物の撮影装置
CN113514755B (zh) * 2021-06-11 2023-06-27 天津津航计算技术研究所 一种pcb板围框电性能自动检测装置及方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046055U (ja) * 1983-09-06 1985-04-01 村田精工株式会社 パ−ツの上下面検査装置
JPS60261274A (ja) * 1984-06-08 1985-12-24 Seiei Kosan Kk 集積回路等検査装置

Also Published As

Publication number Publication date
JPH0166061U (en]) 1989-04-27

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